Aluminum Processing Team
Can be manufactured around
the clock, 7 days a week.
Can be manufactured around
the clock, 7 days a week.
Product Type
Copper Tubed Cold Plate
Overall Dimensions
Typical Total Height: 15-25 mm.
Custom: L 50-1500 mm, W 50-800 mm.
Materials
Base Plate: AL 6061-T6 / AL 6063-T5
Copper Tube: C1220 Oxygen-Free Copper
Port/Connector Options
Threaded, Quick-Disconnect, Barbed (Optional)
Mounting Holes
According to customer drawing/specification
Thermal Performance
Thermal Resistance (R): 0.03 - 0.06 °C/W (@4L/min, 25°C)
Heat Dissipation (Rated): Typ. 500 - 2000 W
Surface Temp. Uniformity (ΔT): < 2 °C
Operating Flow Rate Range
2 - 10 L/min
Pressure Drop (ΔP)
< 35 kPa (@ 4 L/min)
Recommended Coolant
Deionized Water, ≤50% Glycol-Water
1. Thermal-Driven Design
Core Principle: All designs must originate from an accurate heat source layout diagram (locations, dimensions, power levels).
Key Consideration: Providing only total power dissipation is insufficient—this prevents optimization of temperature uniformity and flow path design.
2. Process-Selection Alignment
Core Principle: Match the process to the application: Fly-Cut Surface (for ultimate performance), Deep Tubes (for high pressure/reliability), double side tube (for cost efficiency & dual-side cooling).
Key Consideration: Incorrect selection can lead to significant cost escalation or critical reliability failures.
3. Balanced Flow Path Design
Core Principle: Achieve an optimal balance among flow path length (heat exchange), pressure drop (pumping power), and temperature uniformity.
Key Consideration: Longer flow paths are not inherently better—they cause a sharp increase in pressure drop. Multi-path designs require careful flow distribution.
4. Interface & Integration Priority
Core Principle: Ensure mounting surface flatness ≤ 0.1mm and roughness Ra ≤ 1.6μm.
Key Consideration: This is the prerequisite for achieving low contact thermal resistance. Superior internal performance is negated by poor interface quality. Thermal resistance must be validated under system operating conditions.