The leap in power density and the game of thermal boundaries are driving the four revolutions in solar inverter cooling technology. From the centralized H-bridge's fin air cooling to the three-level N...

This article attempts to sort out the innovation path of HVDC system heat dissipation technology under the background of AI computing power explosion, focusing on two major directions: liquid cooling ...

For heat sink manufacturing, material selection and skiving fin accuracy are the key to success. Faced with the stringent requirements of ultra-thin fin and high-density fin, the core challenge is: ho...

The soaring computing power of AI servers is encountering "thermal constraints" - the power density of chips exceeds 1000W/cm² (such as NVIDIA H100), the power density of cabinets jumps from...

When you see a heat sink as precise as comb teeth in an electronic device, you may not think that its peak performance was determined long before the blade touched the metal. Why are big manufacturers...

As the global energy structure transformation accelerates, the role of energy storage systems in power frequency regulation, new energy consumption and other scenarios is becoming increasingly promine...

The application process of the main materials of the ESS Battery Enclosure is essentially a balancing process between lightweight requirements, thermal management efficiency and full-cycle costs. From...

The safety evolution of the energy storage industry is a systematic change driven by the synergy of technology iteration and safety standards. From the reconstruction of heat dissipation paths, coordi...

As energy storage systems evolve towards large capacity and high energy density, the size matching and compatibility design of ESS Battery Enclosures have become the core issues for improving system e...

With the explosive growth of AI computing power and the continuous increase in power density of data centers, traditional air cooling technology can no longer meet the heat dissipation needs. Liquid c...